With elements integrated directly on the memory module, in particular the voltage regulator (VRM) and the PMIC component for energy consumption management, the RAM DDR5 can heat up more than DDR4.
Already, the first overclockable DDR5 modules are announced with PMICs reinforced with layers of materials accelerating heat dissipation. It will soon be possible to go even further by integrating a liquid cooling system.
The firm Bitspower has mentioned a first device of this type that she plans to offer for sale soon. Such modules already exist for DDR3 and DDR4 (with varying degrees of interest) but the arrival of DDR5 should raise the question of their relevance.
With VRM and the PMIC placed on the bar instead of being present on the motherboard, the heating points will be located directly on the memory. With temperatures that can exceed 50 degrees, new DDR5 memories will not necessarily need specific cooling if the airflow is sufficient. However, for groups of adjoining strips, the temperature could quickly become unmanageable and require reinforced means.